IARPA posts BAA for RAVEN program
By Loren Blinde
January 12, 2016
On January 12, the Intelligence Advanced Research Projects Activity (IARPA) posted a broad agency announcement (Solicitation Number: IARPA-BAA-15-12) for the Rapid Analysis of Various Emerging Nanoelectronics (RAVEN) program. Proposal due date for the initial round of selections is February 29 at 5:00pm EST.
The RAVEN program seeks to develop a prototype analysis tool for acquiring the images and reconstructing all layers (up to 13 metal layers) from a 10 nm integrated circuit chip within an analysis area of 1 cm2. Program goals include: a) minimum 10 nm lateral and vertical resolution; b) non-destructive image acquisition using a single test sample, or destructive image acquisition using at most 5 test samples; c) twenty-five (25) days total to acquire, compile, and reconstruct the images from the sample(s); and d) real-time checking during the acquisition process to eliminate the need for re-scans.
The RAVEN program encompasses four major areas for the tool development: rapid acquisition of images from a bare die; real-time image analysis with in-situ feedback to minimize or eliminate reworks due to image anomalies; innovative algorithms for reconstructing the images of individual device layers and the overall device; and computational resources for acquiring, moving, storing, and analyzing petabyte size data files. Both destructive and non-destructive image acquisition techniques are sought and are described in the BAA. The sample preparation appropriate for a given technique is expected to occur prior to loading into the tool.
Full information is available here.
Source: FedBizOpps
