On October 16, the Defense Advanced Research Projects Agency (DARPA) posted the draft program announcement for Next-Generation Microelectronics Manufacturing (NGMM). The agency will accept feedback for two weeks.
The purpose of this Special Notice is to provide a DRAFT Program Announcement for the upcoming DARPA NGMM Program. This DRAFT will be available for comment and feedback for 14 days, after which time DARPA will post a final Program Announcement. Questions or comments on the DRAFT Program Announcement should be sent to DARPA-SN-24-07@darpa.mil no later than October 30, 2023. This Special Notice is NOT an invitation for proposals and any sent in response will be disregarded. Additionally, DARPA will not comment or provide feedback on any questions related to a proposed technical approach.
The NGMM program will advance the state-of-the-art in three-dimensional heterogeneously integrated (3DHI) microelectronics through the formation of a domestic open-access prototyping and pilot line capability. This announcement solicits proposals for Phases 1 and 2 of the NGMM program. The first phase will focus on installing equipment, establishing baseline fabrication processes, developing a 3D assembly design kit (3D-ADK), and design automation and simulation software tailored to 3DHI.
The second phase will build on Phase 1 to create hardware prototypes, automate processes, and develop emulation capabilities. The end goal of the program is to create a self-sustaining 3DHI manufacturing center owned and operated by a non-federal entity, and accessible to users in academia, government, and industry. Success will be measured by the ability to produce high-performance 3DHI microsystems at reasonable cost with cycle times supporting fast-paced innovative research.
Review the DARPA NGMM draft program announcement.
Source: SAM
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