Mercury Systems, Inc. of Andover, MA announced on June 6 that it received an $8.2 million follow-on order from a leading defense prime contractor for rugged, ultra-compact memory devices integrated into an advanced airborne command, control and intelligence application. The order was booked in the company’s fiscal 2019 fourth quarter and is expected to be shipped over the next several quarters.
The company’s flagship memory product combines Mercury’s best-in-class
technology with the latest commercial memory devices to solve the customer’s
most critical requirements for high-speed data processing. 16 GB of double data
rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) is
embedded into a 16mm x 23mm ball grid array, enabling the customer to save up
to 83% printed circuit board space for SWaP-constrained military applications.
Using automated manufacturing processes, Mercury’s miniaturization
technology transforms a two-dimensional array of discrete memory devices into a
single, trusted, military-hardened three-dimensional device delivering data
transfer rates as high as 2,666 megabits per second (Mbps). Mercury’s entire
portfolio of memory devices is designed and manufactured exclusively in its
five Advanced Microelectronics Centers (AMC) located throughout the U.S.,
assuring customers an affordable domestic supply of trusted microelectronics
for critical military programs.
“We are honored to support our valued customer with state-of-the-art trusted memory devices for applications facing severe physical space constraints,” said Iain Mackie, vice president and general manager of Mercury’s Microelectronics Secure Solutions group. “Our military forces can rest assured that Mercury’s innovative packaging technology ruggedizes the most advanced commercial memory in the smallest possible form factor, thereby freeing valuable circuit board space for additional sensor processing subsystems.”
Source: Mercury Systems
By Loren Blinde
June 10, 2019
