Mercury Systems introduces defense industry’s first 16GB DDR4 high density secure memory device

Mercury Systems, Inc. of Andover, MA announced on October 25 the start of customer engagements for the first BuiltSECURE 16GB high density double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) in a rugged, ultra-compact 16mm x 23mm ball grid array (BGA) package. The Company’s new product was designed using a new packaging technology that doubles the number of the devices embedded in a single package without compromising performance or reliability. While delivering immediate benefits to defense prime contractors requiring DDR4 memory today, it also provides a low-risk path forward to commercializing fifth-generation (DDR5) memory devices with 5 GB/s data transfer speeds. Mercury’s new rugged DDR4 device is ideally suited to address the need for memory resident data in unmanned systems applications and real-time execution of artificial intelligence (AI).

Conventional three-dimensional (3D) packaging technologies embed multiple memory devices in a single package to meet the processing demands of space-constrained military systems. Stacking multiple devices in a single package inherently degrades the signal integrity performance, resulting in low data transfer speeds and compromised long-term reliability performance. The new packaging technology commercialized in the 16GB BuiltSECURE memory device addresses these challenges by significantly reducing crosstalk and return loss while doubling the number of devices embedded in a single package compared to the similar-sized 8GB device. This new military-hardened product supports the high-speed bus rates of today’s fastest processors and field programmable gate array (FPGA) devices, with data transfer rates of up to 2666 MB/s while operating over an extended temperature range of -55 to +125 °C.

“As the market leader in advanced packaging technologies for military applications, Mercury’s enduring commitment to provide performance enhancements to our ultra-SWaP optimized memory devices sets us apart from the competition,” said Iain Mackie, vice president and general manager of Mercury’s Microelectronics Secure Solutions group. “Today’s new product announcement exemplifies the power of Mercury’s next-generation business model to successfully convert our substantial investment in research and development into products that deliver unprecedented capabilities to our military forces.”

Source: Mercury Systems