On August 19, Reston, VA-based Leidos announced that it was awarded the Fully Integrated Lifecycle Mission Support Services 2 (FILMSS 2) contract by the National Aeronautics and Space Administration (NASA) to provide program, science, engineering, operations and project management support at the agency’s Ames Research Center in Silicon Valley, CA. The single award cost-plus fixed-fee and indefinite delivery, indefinite quantity contract holds an approximate value of $270 million. It includes a two-year base period and three one-year options.
“For decades, Ames has accelerated scientific discovery through global research and collaboration,” said Jim Moos, Leidos Civil Group president. “As a company founded and fueled by science, we are pleased to continue supporting critical research missions that will advance human exploration in deep space.”
As the FILMSS 2 prime contractor, Leidos will perform essential activities that enable Ames’ high-end research. This support will include program management, mission implementation, instrument development and collaborative technology advancement for Ames’ virtual institutes. Leidos will also provide assistance to multiple research disciplines, including life sciences, astrobiology, aeronautics and lunar sampling.
Ames is one of ten NASA field centers. Among other core areas of expertise, the center conducts astrobiology and life science research while ensuring space missions remain cost-effective. Ames leverages virtual institutes that bring scientists together from across the globe to virtually collaborate on world-class research and development for NASA.
The Leidos team will leverage the expertise of its portfolio to support this research. These assets include Leidos Biomedical Research, Inc., which serves as the technical support contractor for the Frederick National Laboratory for Cancer Research, and the Leidos Innovations Center (LInC). The LlnC operates out of Dynetics, a wholly owned subsidiary of Leidos, as the company’s research and development arm for advanced technologies.
Source: Leidos
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