On May 3, the Intelligence Advanced Research Projects Activity (IARPA), within the Office of the Director of National Intelligence, issued the Microelectronics in Support of Artificial Intelligence (MicroE4AI) Seedling Broad Agency Announcement (BAA). White papers are due no later than 12:00 p.m. Eastern on May 17, and proposals are due by 4:00 p.m. Eastern on June 30.
The BAA solicits proposals for developing faster, more energy efficient, and more resilient computing tools that are of importance to the future of the national security of the United States and its leadership in artificial intelligence. The solicitation focuses on advanced engineering and applied research efforts into novel computing models, materials, architectures, and algorithms to enable the advancement of artificial intelligence and machine learning. Of interest are research and development efforts that promote advances in micro-electronic devices and circuits, and the chemistry and physics of new materials, which are aimed at overcoming challenges with respect to the physical limits on transistors, electrical interconnects, and memory elements.
“Technology solutions for advanced computing in support of artificial intelligence will require long-term advancements in microelectronics, which will result from fostering unified and multidisciplinary research and development approaches,” said IARPA Director Dr. Catherine Marsh. “Our goal is to advance groundbreaking technologies that will help the Intelligence Community and the country deliver on the promise of AI.”
IARPA anticipates granting multiple seedling awards to explore and develop novel technology solutions. To learn more about the BAA, including submission deadline, eligibility and proposal requirements, visit: IARPA-BAA-21-02.
Source: ODNI
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